Intel Celeron 927UE vs Intel Celeron B810E: comparison
Comparison of Intel Celeron 927UE and Intel Celeron B810E: key differences and a full specification table.
Key differences
Intel Celeron 927UE has a lower TDP (17 W vs 35 W) and a finer process node (22 nm vs 32 nm).
At the same time, Intel Celeron B810E has more cores (2 vs 1), more threads (2 vs 1), a higher base clock (1.6 GHz vs 1.5 GHz) and a larger L3 cache (2 MB vs 1 MB).
Both processors match on: memory channels (2), PCIe version (2).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Celeron 927UE | Intel Celeron B810E |
|---|---|---|
| Cores / threads | 1 / 1 | 2 / 2 |
| L3 cache | 1 MB | 2 MB |
| TDP | 17 W | 35 W |
| Process | 22 nm | 32 nm |
| Integrated graphics | Графические решения Intel HD для процессоров Intel 3-го поколения | Графические решения Intel HD для процессоров Intel 2-го поколения |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Celeron 927UE | Intel Celeron B810E |
|---|---|---|
| General | ||
| Model | 927UE | B810E |
| Codename | Ivy Bridge | Sandy Bridge |
| Segment | Embedded | Embedded |
| Product line | Устаревший процессор Intel Celeron | Устаревший процессор Intel Celeron |
| Process | 22 nm | 32 nm |
| Launch date | Q1 2013 | Q2 2011 |
| Status | Discontinued | Discontinued |
| Servicing status | End of Servicing Lifetime | End of Servicing Updates |
| End of servicing updates | 12/31/2019 | — |
| Embedded options available | Yes | Yes |
| Use conditions | Embedded Broad Market Commercial Temp, PC/Client/Tablet | Embedded Broad Market Commercial Temp, PC/Client/Tablet |
| CPU | ||
| Cores | 1 | 2 |
| Threads | 1 | 2 |
| Multithreading (SMT/HT) | No | No |
| Base clock | 1.5 GHz | 1.6 GHz |
| L3 cache | 1 MB | 2 MB |
| Bus speed | 5 GT/s | — |
| TDP | 17 W | 35 W |
| Turbo Boost | No | No |
| 64-bit support | Yes | Yes |
| Instruction set width | — | 64 bit |
| Memory | ||
| Max memory size | 16 GB | 16.6 GB |
| Memory types | DDR3, DDR3L | DDR3 |
| Memory channels | 2 | 2 |
| Max memory bandwidth | 25.6 GB/s | 21.3 GB/s |
| ECC memory supported | Yes | Yes |
| Graphics | ||
| Integrated graphics | Графические решения Intel HD для процессоров Intel 3-го поколения | Графические решения Intel HD для процессоров Intel 2-го поколения |
| Has integrated graphics | Yes | Yes |
| Graphics base frequency | 350 MHz | 650 MHz |
| Graphics max frequency | 900 MHz | 1 GHz |
| Max displays | 2 | 2 |
| Quick Sync Video | No | No |
| Clear Video HD | No | No |
| Clear Video | — | No |
| Graphics output | eDP/DP/HDMI/SDVO/CRT | eDP/DP/HDMI/SDVO/CRT |
| InTru 3D | No | No |
| Macrovision license required | — | No |
| I/O and interfaces | ||
| PCI Express revision | 2 | 2 |
| PCI Express lanes | 1 | 16 |
| PCI Express configurations | 1x16, 2x8, 1x8 & 2x4 | 1x16, 2x8, 1x8 2x4 |
| 4G WiMAX wireless | — | No |
| Package and thermal | ||
| Sockets supported | FCBGA1023 | FCBGA1023 |
| Max CPU configuration | 1 | — |
| Package size | BGA1023 31mm x 24mm | 31mm x 24mm (FCBGA1023) |
| TJUNCTION | 105 °C | 100 °C |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | No | No |
| AES-NI | No | No |
| Intel Trusted Execution Technology | No | No |
| Anti-Theft Technology | No | No |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | — | Yes |
| Thermal Monitoring Technologies | Yes | Yes |
| Flex Memory Access | Yes | Yes |
| Fast Memory Access | Yes | Yes |