Intel Xeon W-11155MRE vs Intel Xeon W-1250TE: comparison
Comparison of Intel Xeon W-11155MRE and Intel Xeon W-1250TE: key differences and a full specification table.
Key differences
Intel Xeon W-11155MRE has a higher maximum clock (4.4 GHz vs 3.8 GHz), a finer process node (10 nm vs 14 nm), a newer PCIe version (4 vs 3) and a higher maximum integrated graphics clock (1.25 GHz vs 1.15 GHz).
At the same time, Intel Xeon W-1250TE has more cores (6 vs 4), more threads (12 vs 8) and a larger L3 cache (12 MB vs 8 MB).
Both processors match on: maximum memory size (128 GB), memory channels (2).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Xeon W-11155MRE | Intel Xeon W-1250TE |
|---|---|---|
| Cores / threads | 4 / 8 | 6 / 12 |
| Max boost clock | 4.4 GHz | 3.8 GHz |
| L3 cache | 8 MB | 12 MB |
| TDP | — | 35 W |
| Process | 10 nm | 14 nm |
| Integrated graphics | UHD-графика Intel для процессоров Intel Core 11-го поколения | UHD-графика Intel 630 |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Xeon W-11155MRE | Intel Xeon W-1250TE |
|---|---|---|
| General | ||
| Model | W-11155MRE | W-1250TE |
| Codename | Tiger Lake | Comet Lake |
| Segment | Embedded | Embedded |
| Product line | Процессор Intel Xeon W | Процессор Intel Xeon W |
| Process | 10 nm | 14 nm |
| Launch date | Q3 2021 | Q2 2020 |
| Status | Launched | Launched |
| Embedded options available | Yes | Yes |
| Use conditions | Embedded Broad Market Extended Temp, Industrial Extended Temp | Embedded Broad Market Commercial Temp |
| CPU | ||
| Cores | 4 | 6 |
| Threads | 8 | 12 |
| Multithreading (SMT/HT) | Yes | Yes |
| Base clock | — | 2.4 GHz |
| Max boost clock | 4.4 GHz | 3.8 GHz |
| Turbo Boost 2.0 frequency | — | 3.8 GHz |
| L3 cache | 8 MB | 12 MB |
| Bus speed | — | 8 GT/s |
| TDP | — | 35 W |
| Configurable TDP-up | 45 W | — |
| Configurable TDP-down | 35 W | — |
| cTDP-up base frequency | 2.4 GHz | — |
| cTDP-down base frequency | 1.9 GHz | — |
| Turbo Boost | Yes (2) | Yes (2) |
| 64-bit support | — | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.1, SSE4.2, AVX2, AVX-512 | SSE4.1, SSE4.2, AVX2 |
| Memory | ||
| Max memory size | 128 GB | 128 GB |
| Memory types | DDR4 | DDR4 |
| Memory channels | 2 | 2 |
| Max memory bandwidth | — | 41.6 GB/s |
| ECC memory supported | Yes | Yes |
| Graphics | ||
| Integrated graphics | UHD-графика Intel для процессоров Intel Core 11-го поколения | UHD-графика Intel 630 |
| Has integrated graphics | Yes | Yes |
| Graphics base frequency | 350 MHz | 350 MHz |
| Graphics max frequency | 1.25 GHz | 1.15 GHz |
| Graphics units | 16 | — |
| Graphics video max memory | — | 64 GB |
| Max displays | 4 | 3 |
| Max resolution (DP) | 7680x4320@60Hz | 4096x2304@60Hz |
| Max resolution (HDMI) | 4096x2304@60Hz | 4096x2160@30Hz |
| Max resolution (eDP) | 4096x2304@60Hz | 4096x2304@60Hz |
| DirectX | 12.1 | 12 |
| OpenGL | 4.6 | 4.5 |
| OpenCL | 3 | — |
| Graphics device ID | 0x9A68 | 0x9BE6 |
| Quick Sync Video | Yes | Yes |
| Clear Video HD | — | Yes |
| Clear Video | — | Yes |
| Graphics output | eDP 1.4b, MIPI-DSI 2.0, DP 1.4, HDMI 2.0b | eDP/DP/HDMI/DVI |
| InTru 3D | — | Yes |
| 4K support | — | Yes, at 60Hz |
| I/O and interfaces | ||
| PCI Express revision | 4 | 3 |
| Chipset PCIe revision | 3 | — |
| PCI Express lanes | 20 | 16 |
| PCI Express configurations | Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 | Up to 1x16, 2x8, 1x8+2x4 |
| Scalability | — | 1S Only |
| Thunderbolt 4 | Yes | — |
| Package and thermal | ||
| Sockets supported | FCBGA1787 | FCLGA1200 |
| Max CPU configuration | 1 | 1 |
| Package size | 50 x 26.5 | 37.5mm x 37.5mm |
| TJUNCTION | 100 °C | 100 °C |
| Min operating temperature | -40 °C | — |
| Max operating temperature | 100 °C | — |
| Thermal solution specification | — | PCG 2015B |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | Yes |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | Yes | Yes |
| Execute Disable Bit | — | Yes |
| Intel Trusted Execution Technology | No | Yes |
| Secure Key | — | Yes |
| Intel OS Guard | Yes | Yes |
| Intel Boot Guard | Yes | Yes |
| Intel Software Guard Extensions | No | Yes |
| Mode-based Execute Control | Yes | — |
| Control-Flow Enforcement Technology | Yes | — |
| Total Memory Encryption | No | — |
| vPro Eligibility | — | Intel vPro Platform |
| Technologies | ||
| Enhanced SpeedStep | — | Yes |
| Idle States | — | Yes |
| Thermal Monitoring Technologies | Yes | Yes |
| Identity Protection Technology | — | Yes |
| Deep Learning Boost | Yes | — |
| Volume Management Device | Yes | — |
| Speed Shift Technology | Yes | — |
| Smart Sound Technology | Yes | — |
| HD Audio | Yes | — |
| Gaussian & Neural Accelerator | Yes (2) | — |
| MIPI SoundWire | Yes (1.1) | — |
| AVX-512 FMA units | 4 | — |
| Time Coordinated Computing | Yes | — |