Intel Xeon L5618 vs Intel Xeon L3426: comparison

Comparison of Intel Xeon L5618 and Intel Xeon L3426: key differences and a full specification table.

Key differences

Intel Xeon L5618 has a higher base clock (1.87 GHz vs 1.86 GHz), a lower TDP (40 W vs 45 W) and a finer process node (32 nm vs 45 nm).

At the same time, Intel Xeon L3426 has a higher maximum clock (3.2 GHz vs 2.26 GHz).

Both processors match on: core count (4), thread count (8).

These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.

Key specifications

ParameterIntel Xeon L5618Intel Xeon L3426
Cores / threads 4 / 8 4 / 8
Max boost clock 2.26 GHz 3.2 GHz
L3 cache — 8 MB
TDP 40 W 45 W
Process 32 nm 45 nm

Full specification table

Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.

Parameter Intel Xeon L5618 Intel Xeon L3426
General
Model L5618 L3426
Codename Westmere EP Lynnfield
Segment Server Server
Product line Устаревшие процессоры Intel Xeon Устаревшие процессоры Intel Xeon
Process 32 nm 45 nm
Launch date Q1 2010 Q3 2009
Status Discontinued Discontinued
Expected discontinuance — Q4 2012
Servicing status End of Servicing Lifetime End of Servicing Lifetime
Embedded options available Yes No
Use conditions Communications —
CPU
Cores 4 4
Threads 8 8
Multithreading (SMT/HT) Yes Yes
Base clock 1.87 GHz 1.86 GHz
Max boost clock 2.26 GHz 3.2 GHz
L3 cache — 8 MB
Cache (level unspecified) 12 MB —
Bus speed 5.86 GT/s 2.5 GT/s
TDP 40 W 45 W
Turbo Boost Yes (1) Yes (1)
64-bit support Yes Yes
Instruction set width — 64 bit
Instruction set extensions — SSE4.2
Memory
Max memory size — 32 GB
Memory types — DDR3
Memory channels — 2
Max memory bandwidth — 21 GB/s
ECC memory supported — Yes
Physical address extensions — 36-bit
I/O and interfaces
PCI Express revision — 2
PCI Express lanes — 16
PCI Express configurations — 1x16, 2x8, 4x4
Package and thermal
Sockets supported FCLGA1366 LGA1156
Max CPU configuration — 1
Package size — 37.5mm x 37.5mm
TCASE 87 °C 58.3 °C
Die size — 296 mm²
Transistors (millions) — 774 million
Security and virtualization
Virtualization (VT-x / AMD-V) Yes Yes
Virtualization for Directed I/O (VT-d) Yes Yes
Extended Page Tables (EPT) Yes Yes
AES-NI Yes No
Execute Disable Bit — Yes
Intel Trusted Execution Technology Yes Yes
Technologies
Enhanced SpeedStep — Yes
Idle States Yes Yes
Thermal Monitoring Technologies — No

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