Intel Pentium G3320TE vs Intel Xeon E3-1125C v2: comparison
Comparison of Intel Pentium G3320TE and Intel Xeon E3-1125C v2: key differences and a full specification table.
Key differences
Intel Pentium G3320TE has a lower TDP (35 W vs 40 W).
At the same time, Intel Xeon E3-1125C v2 has more cores (4 vs 2), more threads (8 vs 2), a higher base clock (2.5 GHz vs 2.3 GHz) and a larger L3 cache (8 MB vs 3 MB).
Both processors match on: process node (22 nm), maximum memory size (32 GB), memory channels (2), PCIe version (3).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Pentium G3320TE | Intel Xeon E3-1125C v2 |
|---|---|---|
| Cores / threads | 2 / 2 | 4 / 8 |
| L3 cache | 3 MB | 8 MB |
| TDP | 35 W | 40 W |
| Process | 22 nm | 22 nm |
| Integrated graphics | Графические решения Intel HD для процессоров Intel 4-го поколения | — |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Pentium G3320TE | Intel Xeon E3-1125C v2 |
|---|---|---|
| General | ||
| Model | G3320TE | E3-1125CV2 |
| Codename | Haswell | Gladden |
| Segment | Embedded | Embedded |
| Product line | Процессор Intel Pentium серии G | Семейство процессоров Intel Xeon E3 v2 |
| Process | 22 nm | 22 nm |
| Launch date | Q3 2013 | Q3 2013 |
| Status | Discontinued | Discontinued |
| Servicing status | End of Servicing Lifetime | End of Servicing Lifetime |
| End of servicing updates | 06/30/2021 | 12/31/2019 |
| Embedded options available | Yes | Yes |
| Use conditions | Embedded Broad Market Commercial Temp, PC/Client/Tablet | Communications |
| CPU | ||
| Cores | 2 | 4 |
| Threads | 2 | 8 |
| Multithreading (SMT/HT) | No | Yes |
| Base clock | 2.3 GHz | 2.5 GHz |
| L3 cache | 3 MB | 8 MB |
| Bus speed | 5 GT/s | 5 GT/s |
| TDP | 35 W | 40 W |
| Turbo Boost | No | No |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.1, SSE4.2 | SSE4.1, SSE4.2, AVX |
| QPI links | 1 | — |
| Memory | ||
| Max memory size | 32 GB | 32 GB |
| Memory types | DDR3, DDR3L | DDR3, DDR3L |
| Memory channels | 2 | 2 |
| Max memory bandwidth | 21.3 GB/s | 25.6 GB/s |
| ECC memory supported | Yes | Yes |
| Graphics | ||
| Integrated graphics | Графические решения Intel HD для процессоров Intel 4-го поколения | — |
| Has integrated graphics | Yes | — |
| Graphics base frequency | 350 MHz | — |
| Graphics max frequency | 1 GHz | — |
| Graphics video max memory | 1 GB | — |
| Max displays | 3 | — |
| Quick Sync Video | Yes | — |
| Clear Video HD | No | — |
| Graphics output | eDP/DP/HDMI/DVI/VGA | — |
| I/O and interfaces | ||
| PCI Express revision | 3 | 3 |
| PCI Express lanes | 16 | 20 |
| PCI Express configurations | Up to 1x16, 2x8, 1x8/2x4 | 1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4 |
| Package and thermal | ||
| Sockets supported | FCLGA1150 | FCBGA1284 |
| Max CPU configuration | 1 | 1 |
| Package size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| TJUNCTION | — | 100 °C |
| TCASE | 72 °C | — |
| Thermal solution specification | PCG 2013A | — |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | No | Yes |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | No | Yes |
| Execute Disable Bit | Yes | Yes |
| Intel Trusted Execution Technology | No | Yes |
| Secure Key | Yes | — |
| Stable IT Platform Program | No | — |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | Yes | Yes |
| Transactional Synchronization Extensions | No | — |
| Flex Memory Access | — | Yes |
| Fast Memory Access | — | Yes |