Intel Core i5-4570TE vs Intel Celeron 1020E: comparison
Comparison of Intel Core i5-4570TE and Intel Celeron 1020E: key differences and a full specification table.
Key differences
Intel Core i5-4570TE has more threads (4 vs 2), a higher base clock (2.7 GHz vs 2.2 GHz), a larger L3 cache (4 MB vs 2 MB) and a higher maximum memory size (32 GB vs 16 GB).
Both processors match on: core count (2), TDP (35 W), process node (22 nm), memory channels (2), maximum integrated graphics clock (1 GHz).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | Intel Core i5-4570TE | Intel Celeron 1020E |
|---|---|---|
| Cores / threads | 2 / 4 | 2 / 2 |
| Max boost clock | 3.3 GHz | — |
| L3 cache | 4 MB | 2 MB |
| TDP | 35 W | 35 W |
| Process | 22 nm | 22 nm |
| Integrated graphics | Intel HD Graphics 4600 | Графические решения Intel HD для процессоров Intel 3-го поколения |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | Intel Core i5-4570TE | Intel Celeron 1020E |
|---|---|---|
| General | ||
| Model | i5-4570TE | — |
| Codename | Haswell | Ivy Bridge |
| Segment | Embedded | Embedded |
| Product line | Процессоры Intel Core i5 4-го поколения | Процессор Intel Celeron серии 1000 |
| Process | 22 nm | 22 nm |
| Launch date | Q2 2013 | Q1 2013 |
| Status | Discontinued | Discontinued |
| Servicing status | End of Servicing Lifetime | End of Servicing Lifetime |
| End of servicing updates | 06/30/2021 | 12/31/2019 |
| Embedded options available | Yes | Yes |
| Use conditions | Embedded Broad Market Commercial Temp, PC/Client/Tablet | Embedded Broad Market Commercial Temp, PC/Client/Tablet |
| Description | — | ECC on BGA only |
| CPU | ||
| Cores | 2 | 2 |
| Threads | 4 | 2 |
| Multithreading (SMT/HT) | Yes | No |
| Base clock | 2.7 GHz | 2.2 GHz |
| Max boost clock | 3.3 GHz | — |
| Turbo Boost 2.0 frequency | 3.3 GHz | — |
| L3 cache | 4 MB | 2 MB |
| Bus speed | 5 GT/s | 5 GT/s |
| TDP | 35 W | 35 W |
| Turbo Boost | Yes (2) | No |
| 64-bit support | Yes | Yes |
| Instruction set width | 64 bit | 64 bit |
| Instruction set extensions | SSE4.1, SSE4.2, AVX2 | SSE4.1, SSE4.2 |
| Memory | ||
| Max memory size | 32 GB | 16 GB |
| Memory types | DDR3 | DDR3, DDR3L |
| Memory channels | 2 | 2 |
| Max memory bandwidth | 25.6 GB/s | 25.6 GB/s |
| ECC memory supported | Yes | Yes |
| Graphics | ||
| Integrated graphics | Intel HD Graphics 4600 | Графические решения Intel HD для процессоров Intel 3-го поколения |
| Has integrated graphics | Yes | Yes |
| Graphics base frequency | 350 MHz | 650 MHz |
| Graphics max frequency | 1 GHz | 1 GHz |
| Graphics video max memory | 1.7 GB | — |
| Max displays | 3 | 3 |
| Quick Sync Video | Yes | No |
| Clear Video HD | Yes | No |
| Graphics output | — | eDP/DP/HDMI/SDVO/CRT |
| InTru 3D | Yes | No |
| Flexible Display Interface | Yes | — |
| I/O and interfaces | ||
| PCI Express revision | 3 | 2 |
| PCI Express lanes | 16 | 1 |
| PCI Express configurations | Up to 1x16, 2x8, 1x8 2x4 | 1x16, 2x8, 1x8 & 2x4 |
| Scalability | 1S Only | — |
| Package and thermal | ||
| Sockets supported | FCLGA1150 | FCPGA988, FCBGA1023 |
| Max CPU configuration | 1 | 1 |
| Package size | 37.5mm x 37.5mm (LGA 1150) | 37.5mm x 37.5mm (rPGA988B); 31mm x 24mm (BGA1023) |
| TJUNCTION | — | 105 °C |
| TCASE | 66.35 °C | — |
| Thermal solution specification | PCG 2013A | — |
| Security and virtualization | ||
| Virtualization (VT-x / AMD-V) | Yes | Yes |
| Virtualization for Directed I/O (VT-d) | Yes | No |
| Extended Page Tables (EPT) | Yes | Yes |
| AES-NI | Yes | No |
| Execute Disable Bit | Yes | Yes |
| Intel Trusted Execution Technology | Yes | No |
| Secure Key | Yes | — |
| Intel OS Guard | Yes | — |
| Anti-Theft Technology | Yes | No |
| vPro Eligibility | Intel vPro Platform | — |
| Technologies | ||
| Enhanced SpeedStep | Yes | Yes |
| Idle States | Yes | Yes |
| Thermal Monitoring Technologies | Yes | Yes |
| Identity Protection Technology | Yes | — |
| Transactional Synchronization Extensions | No | — |
| Flex Memory Access | — | Yes |
| Fast Memory Access | — | Yes |