AMD Ryzen 7 5800X3D vs B99: comparison
Comparison of AMD Ryzen 7 5800X3D and B99: key differences and a full specification table.
Key differences
AMD Ryzen 7 5800X3D has more cores (8 vs 4), more threads (16 vs 4) and a higher base clock (3.4 GHz vs 3.3 GHz).
At the same time, B99 has a lower TDP (95 W vs 105 W).
These are specification values: they show differences between the models but do not determine a performance winner. For a specific workload, rely on independent benchmarks.
Key specifications
| Parameter | AMD Ryzen 7 5800X3D | B99 |
|---|---|---|
| Cores / threads | 8 / 16 | 4 / 4 |
| Max boost clock | 4.5 GHz | — |
| L3 cache | 96 MB | — |
| TDP | 105 W | 95 W |
| Process | 7 nm | — |
| Integrated graphics | Discrete Graphics Card Required | — |
Full specification table
Differing values are highlighted. This is not a better/worse rating: numbers from different architectures are not always comparable.
| Parameter | AMD Ryzen 7 5800X3D | B99 |
|---|---|---|
| General | ||
| Codename | Vermeer | Phenom |
| Segment | Desktop | Desktop |
| Product line | AMD Ryzen 7 Desktop Processors | AMD Business Class - AMD Phenom X4 Quad-Core |
| Product family | AMD Ryzen Processors | AMD Phenom |
| Architecture | "Zen 3" | — |
| Process | 7 nm | — |
| Dies per package | 1 | — |
| Unlocked for overclocking | — | No |
| Operating system support | Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit | — |
| Regional availability | Global, China, NA, EMEA, APJ, LATAM | — |
| Target market | Enthusiast Desktop | — |
| Consumer oriented | Yes | — |
| Recommended cooling | Liquid cooler recommended for optimal performance | — |
| CPU | ||
| Cores | 8 | 4 |
| Threads | 16 | 4 |
| Multithreading (SMT/HT) | Yes | — |
| Base clock | 3.4 GHz | 3.3 GHz |
| Max boost clock | 4.5 GHz | — |
| L1 cache | 512 KB | — |
| L2 cache | 4 MB | 2 MB |
| L3 cache | 96 MB | — |
| TDP | 105 W | 95 W |
| Instruction set | x86-64 | — |
| Instruction set extensions | AES, AMD-V, AVX, AVX2, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 | — |
| Boost technology | Precision Boost 2 | — |
| Memory | ||
| Max memory size | 128 GB | — |
| Memory types | DDR4 | — |
| Memory channels | 2 | — |
| ECC memory supported | Yes | — |
| Memory speed (text) | 2x1R | DDR4-3200 | | | 2x2R | DDR4-3200 | | | 4x1R | DDR4-2933 | | | 4x2R | DDR4-2667 | — |
| Memory form factor | UDIMM | — |
| Graphics | ||
| Integrated graphics | Discrete Graphics Card Required | — |
| Has integrated graphics | No | No |
| I/O and interfaces | ||
| PCI Express revision | 4 | — |
| PCI Express lanes | 24 | — |
| SATA ports | 2 | — |
| USB 2.0 ports | 0 | — |
| USB 3.2 Gen 2 ports | 4 | — |
| NVMe support | Boot, RAID0, RAID1, RAID10 | — |
| Compatible chipsets | X570, X470, B550, B450, A520 | — |
| USB Type-C support | Yes | — |
| USB 3.2 Gen 1 ports | 0 | — |
| Package and thermal | ||
| Sockets supported | AM4 | AM3 |
| Max CPU configuration | 1 | — |
| TJUNCTION | 90 °C | — |
| Die size | 74 mm² | — |
| I/O die process | 12 nm | — |
| I/O die size | 125 mm² | — |
| Security and virtualization | ||
| Supported technologies | AMD 3D V-Cache Technology, Windows 11 Gaming, AMD Ryzen VR-Ready Premium | — |
| AMD PRO technologies | No | — |
| Identifiers | ||
| Product ID (OEM) | — | HDXB99WFK4DGM |
| Bundled cooler | Not included | — |